Hello friends,

I recently became aware that the Philips FTF3020 of 1998 was made of 6 image sensor elements mounted onto one package.
When I first heard about this concept in the case of Sony's 33x44mm sensors, I assumed they were the first to do so.
If chip yield could largely be sidestepped as an issue, this early, by choosing smaller dies that were later assembled into one, why did it take so long to develop large sensors as a commercial product?