>>3963881When fab costs for large dies fall further. Cost rises exponentially with die size, due to multiple factors:
- Increased probably of a defect per-die at the same defect rate per unit wafer area,
- Decreased number of dies per wafer
- Decreased pacing density (making number of dies per wafer scale even worse as dies grow)
- Pattern mask cost increase as die size increases
- Diminishing returns to pixel size due to dark areas (more area taken up by interconnect wiring when that wiring needs to reach 12mm vs. 24mm)
- Even greater expense when attempting to use modern packaging techniques like die-stacking, so your large sensor may end up being worse in some performance metrics than a smaller but more advanced sensor
etc. Sucks that 'digital medium format' barely even touches 645, but a 'real' digital medium format sensor would cost an obscene amount even comapred to a Phase One rig or similar.
